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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology

Year : 1990 Volume number : 13 Issue: 04

Characteristics Of Heat Transfer In Small Disk Enclosures At High Rotation Speeds (Article)
Subject: Characteristics , Heat Transfer , Enclosure , Rotation
Author: Isamu Sato      Koji Otani      Makoto Mizukami     
page:      1006 - 1011
A Review Of Thermal Enhancement Techniques For Electronic Systems (Article)
Subject: Electronic Systems , Review , Enhancement , Thermal Performance
Author: L. S Fletcher     
page:      1012 - 1021
High Performance Air Cooled Heat Sinks For Integrated Circuits (Article)
Subject: High Performance , Air Cooling , Heat Sink , Integrated Circuits (Ics)
Author: Dennis J. Herrell      Claude Hilbert     
page:      1022 - 1031
Boiling Incipience And Nucleate Boiling Heat Transfer Of Highly Wetting Dielectric Fluids From Electronic Materials (Article)
Subject: Boiling , Nucleate Boiling , Heat Transfer , Electronic Materials
Author: S. M You      Avram Bar-Cohen      T. W Simon     
page:      1032 - 1039
On The Accommodation Of Coolant Flow Paths In High Density Packaging (Article)
Subject: Coolant , High Density , Packaging , Coolant Flow Paths
Author: Wataru Nakayama     
page:      1040 - 1049
Measured Capacitance Coefficients Of Multiconductor Microstrip Lines With Small Dimensions (Article)
Subject: Capacitance Measurement , Microstrip Line , Multiconductor , Small Dimensions
Author: Mou-Shiung Lin     
page:      1050 - 1054
Laser Drilling Of Microvias In Epoxy-Glass Printed Circuit Boards (Article)
Subject: Epoxy-Glass , Microvia , Printed Circuit Board , Laser Drilling
Author: Ami Kestenbaum      J.F. D'Amico      Brent J. Blumenstock      M.A. Deangelo     
page:      1055 - 1062
Electrical Conduction Through Cu2s Corrosion Films On Copper Contacts (Article)
Subject: Electrical Conduction , Cu2s , Corrosion Films , Copper Contacts
Author: N. Ben Jemaa      Dan Simon      D. L Travers     
page:      1063 - 1067
Experimental Study Of The Conducting Spots In Aluminum Contact Interfaces (Article)
Subject: Electrical Contact , Aluminum , Aging , Contact Spot
Author: Magne Runde      Elin Hodne      Bard Totdal     
page:      1068 - 1073
Coupled Noise And Its Effects On Modern Packaging Technology (Article)
Subject: Noise , Packaging , Three-Dimensional , Low-Noise Packaging
Author: Samuel H. Russ      Cecil O. Alford     
page:      1074 - 1082
Packaging Technology For A Low Temperature Astrometric Sensor Array (Article)
Subject: Packing , Low Temperature , Astrometric , Sensor Array
Author: R. Wayne Johnson      Richard C. Jaeger     
page:      1083 - 1089
Corrosion Criteria For Electronic Packaging. I-A Framework For Corrosion Of Integrated Circuits (Article)
Subject: Corrosion Criteria , Electronic Packaging , Framework , Integrated Circuits
Author: Carl E. Hoge     
page:      1090 - 1097
Corrosion Criteria For Electronic Packaging. Ii. Calculated Corrosion Currents And Acceleration Factors (Article)
Subject: Electronic Packaging , Corrosion Current Density , Acceleration Factor , Corrosion Criteria
Author: Carl E. Hoge     
page:      1098 - 1104
Corrosion Criteria For Electronic Packaging: Iii- Corrosion By Package Family (Article)
Subject: Corrosion Criteria , Electronic Packaging , Package Family , Aluminum
Author: Carl E. Hoge     
page:      1105 - 1109
Spurious Effects Induced By Current Switching In Power Strips Of Wafer Package (Article)
Subject: Spurious Effects , Current Switching , Power Strips , Wafer Package
Author: J. Chilo      P. Fort     
page:      1110 - 1114
Low Dielectric Material For Multilayer Printed Wiring Boards (Article)
Subject: Low-Dielectrics , Multilayer , Printed Circuit Board , Wiring
Author: A Takahashi      Akira Nagai     
page:      1115 - 1120
On Microstrip Capacitance And Impedance (Article)
Subject: Microstrip , Capacitance , Impedance , Mathematical Models
Author: Arthur. T Murphy      Frederick J Young     
page:      1121 - 1123
High Field Capacitance-Temperature Behavior Of Batio3 Ceramic Disc Capacitors (Article)
Subject: High Field , Ceramics , Capacitance-Temperature , Ceramic Disc Capacitors
Author: Colin K. Campbell      Jacobus Daniel Van Wyk     
page:      1124 - 1127
Void Free Bonding Of Large Silicon Dice Using Gold-Tin Alloys (Article)
Subject: Silicon , Bonding , Bond Degradation , Significant Effects
Author: Chen Y. Wang      Chin C. Lee     
page:      1128 - 1134
Thermal Stresses In Multilayer Ceramic Capacitors: Numerical Simulations (Article)
Subject: Thermal Stresses , Multilayer Cermic Capacitor , Numerical Simulations , Geometry
Author: Geoffrey C. Scott      Greg Astfalk     
page:      1135 - 1145
A New Index S For Evaluating Solder Joint Thermal Fatigue Strength (Article)
Subject: Evaluating , Solder Joint Reliability , Fatigue Strength , Thermal
Author: Akio Yasukawa     
page:      1146 - 1153
A New High Temperature Multilayer Capacitor With Acrylate Dielectrics (Article)
Subject: High Temperature , Multilayer , Capacitors And Dielectrics , Acrylate
Author: D. G Shaw      Gary L. Powers      Angelo Yializis     
page:      611 - 616
Optical And Electrical Investigation Of Ion Bombarded Gaas (Article)
Subject: Optical , Gaas , Ion Bombardment , Investigation
Author: Sidhartha Sen      Ashok Vaseashta     
page:      617 - 622
Field-Induced Instabilities In Polyimide Passivated Lateral P-N-P Transistors (Article)
Subject: Instabilities , Polyimide , Field-Induced Instabilities , P-N-P Transistors
Author: Terence B. Hook      Badih El-Kareh     
page:      623 - 628
Damage In Silicon Caused By Magnetron Ion Etching And Its Recovery Effect (Article)
Subject: Etching , Damage In Silicon Caused , Magnetron Ion Etching , Recovery Effect
Author: Hiroaki Iwakuro      Minoru Hirai     
page:      629 - 632
Prototype Packages In Aluminum Nitride For High Performance Electronic Systems (Article)
Subject: Prototype , Aluminum Nitride , High Performance , Electronic Systems
Author: John A. Sparrow      Kevin J. Lodge     
page:      633 - 638
Low Temperature Co-Fired Glass Ceramic High Density Interconnect Substrate With Improved Thermal Management (Article)
Subject: Thermal Management , Substrate Degradation , Low Temperature , Glass Ceramics
Author: Angela J. Martin      Edward L. Rich, Iii     
page:      639 - 646
Preparation, Structure, And Fracture Modes Of Pb-Sn And Pb-In Terminated Flip-Chips Attached To Gold Capped Microsockets (Article)
Subject: Preparation , Structure , Fracture , Flip-Chip
Author: Karl J. Puttlitz     
page:      647 - 655
Flip-Chip Soldering To Bare Copper Circuits (Article)
Subject: Flip-Chip , Soldering , Bare , Copper Circuits
Author: Anthony P. Ingraham      Jack M. Mccreary     
page:      656 - 660
Strength And Reliability Of Ceramic Modules Soldered To Flexible Cables (Article)
Subject: Strength , Reliability , Ceramic Modules Soldered , Flexible Cables
Author: Nicholas T. Panousis      James F. Prosser     
page:      661 - 666
Development Of Copper Wire Bonding Application Technology (Article)
Subject: Copper Wire , Bonding , Oscillation , Conventional
Author: Kazuya Fujita      Takamichi Maeda     
page:      667 - 672
A Comparison Of Copper And Gold Wire Bonding On Integrated Circuit Devices (Article)
Subject: Copper Wire , Integrated Circuit , Gold Wire , Comparison
Author: David P. Galloway      David J. Burkhard      Salim L. Khoury     
page:      673 - 681
A New Technique For Testing Tab Bonded Lsis In The Gigahertz Frequency Range (Article)
Subject: Testing Tab Bonded Lsi'S , Lsi , Gigahertz Frequency Range , Tab Bonded
Author: Shin-Ichi Sasaki      Taichi Kon     
page:      682 - 684
New Method Of Water Cleaning For Circuit Substrate (Article)
Subject: Rosin Flux , Rosin Solvent , Water Cleaning , Circuit Substrate
Author: Nao Takayama      Tomiji Sugiyama      Kazuhiko Takahashi     
page:      685 - 692
Terpene Cleaning Of Electronic Assemblies (Article)
Subject: Terpenes , Cleaning , Electronics , Assembling The Technology
Author: Gregory P. Tashjian      George M. Wenger     
page:      693 - 697
Area Distributed Soldering Of Flexible And Rigid Printed Circuit Boards (Article)
Subject: Flexible Printed Circuit , Printed Circuit Board , Area Distributed Soldering , Soldering Of Rigid
Author: W. Pelosi      W.A. Clark     
page:      698 - 703
The Association Of Component Solderability Testing With Board Level Soldering Performance (Article)
Subject: Component Tests , Predict Performance , Conclusion , Recommendation System
Author: Mark A. Kwoka      Paul D. Mullenix     
page:      704 - 712
Materials/Processing Approaches To Phase Stabilization Of Thermally Conductive Pastes (Article)
Subject: Thermally Conductive Pastes , Stabilization , Materials/Processing Approaches , Phase Stabilization
Author: Herbert R. Anderson, Jr      Richard B. Booth     
page:      713 - 717
Microstructural Evolution During Thermomechanical Fatigue Of 62sn-36pb-2ag And 60sn-40pb Solder Joints (Article)
Subject: Microstructural Evolution , Thermomechanical Fatigue , Solder Joint Reliability , Joints
Author: D.R. Frear     
page:      718 - 726
Creep Fatigue Modeling For Solder Joint Reliability Predictions Including The Microstructural Evolution Of The Solder (Article)
Subject: Creep Fatigue Failure. , Solder Joint Reliability , Predictions , Microstructural Evolution
Author: Harold J. Frost      Robert T. Howard     
page:      727 - 735
Mechanical Characteristics Of 96.5 Sn/3.5 Ag Solder In Microbonding (Article)
Subject: Mechanical Characterization , Soldering , Microbonding , Solder In Microbonding
Author: Ryoohei Satoh      Masahide Harada     
page:      736 - 742
Temperature Dependence Of Thermal Expansion Of Ceramics And Metals For Electronic Packages (Article)
Subject: Temperature Dependence , Thermal Expansion , Ceramics , Electronic Packaging
Author: Rajen Chanchani      Peter M. Hall     
page:      743 - 750
Large Scale Multilayer Glass-Ceramic Substrate For Supercomputer (Article)
Subject: Large Scale , Multilayer , Glass Ceramics , Supercomputer
Author: Yuzo Shimada      Keiichiro Kata      Hideo Takamizawa     
page:      751 - 758
High Performance Screen Printable Silicone As Selective Hybrid Ic Encapsulant (Article)
Subject: High Performance , Screen Printing , Hybrid , Encapsulant
Author: C. P. Wong     
page:      759 - 765
Effects Of Polymer/Metal Interaction In Thin-Film Multichip Module Applications (Article)
Subject: Polymer , Multichip Module , Interaction Analysis , Thin-Film Devices
Author: Lwona Turlik      Lih-Tyng Hwang      Glenn A. Rinne     
page:      766 - 774
New Screen Printable Polyimide For Ic Devices (Article)
Subject: Screen Printing , Polyimide , Ic Devices , Polyimide Particles
Author: Kenji Suzuki      Tohru Kikuchi     
page:      775 - 779
Self-Aligned Flip-Chip Assembly Of Protonic Devices With Electrical And Optical Connections (Article)
Subject: Self-Aligned , Flip-Chip , Electrical And Optical Properties , Photonic Devices
Author: Michael J. Wale      Colin Edge     
page:      780 - 786
Esd Packaging Requirements For An Opto-Electronic Receiver Module (Article)
Subject: Esd , Opto-Electronic , Receiver Module , Packaging
Author: Eric M. Foster      Richard J. Wolff     
page:      787 - 790
Single-Mode Fiber Packaging For Semiconductor Optical Devices (Article)
Subject: Single-Mode Optical Fiber , Semiconductor Devices , Optical Devices , Assembly
Author: James W. Mann      Leslie A. Reith     
page:      791 - 797
Optical Components-The New Challenge In Packaging (Article)
Subject: Optical Components , Challenge , Packaging , Optical Communication
Author: Brian M. Macdonald      Michael R. Matthews      Keith R. Preston     
page:      798 - 806
The Two Fiber Mechanical Splice Of Low Loss For Optical Fiber Cable (Article)
Subject: Mechanical Splice , Optical Fiber , Cable , Fiber
Author: M Miyazaki      Morinobu Mizutani     
page:      807 - 810
Low-Loss Fusion Splicing Of Erbium-Doped Optical Fibers For High Performance Fiber Amplifiers (Article)
Subject: Optical Fibers , High Performance , Low-Loss Fusion Splicing , Fiber Amplifiers
Author: Mahendra P. Singh      James O. Reese      T. Michael Wei     
page:      811 - 813
3-D Interconnection For Ultra-Dense Multichip Modules (Article)
Subject: Multichip Modules , 3-D Interconnection , Ultra-Dense , Gold Wire
Author: Therry Lemoine      Christian Val     
page:      814 - 821
Automatic Testing Of Metallized Ceramic-Polyimide (Mcp) Substrates (Article)
Subject: Automatic Testing , Substrate , Metallized Ceramic-Polyimide (Mcp)
Author: Jerzy Zalesinski      Martin Mancini      Steven Defoster     
page:      822 - 827
Gaas Multichip Module For A Parallel Processing System (Article)
Subject: Gaas , Multichip Module , Parallel Processing
Author: Susumu Kimijima      Toshio Sudo      Kenji Itoh      Takeshi Miyagi     
page:      828 - 832
Computation Of Transients In Lossy Vlsi Packaging Interconnections (Article)
Subject: Computation , Transients , Vlsi , Packaging
Author: J. C Liao      John L. Prince     
page:      833 - 839
Analysis And Simulation Of Multiconductor Transmission Lines For High-Speed Interconnect And Package Design (Article)
Subject: Waveform Analysis , Simulation , High-Speed Interconnect , Package Modeling
Author: Mani Soma      Hong You     
page:      839 - 846
The Impact Of Packaging On The Reliability Of Flip-Chip Solder Bonded Devices (Article)
Subject: Impact Analysis , Flip-Chip , Solder Bonded Devices , Predicted Field Lifetimes
Author: Kevin J. Lodge      David J. Pedder     
page:      847 - 855
Investigations Of Failure Mechanisms Of Tab-Bonded Chips During Thermal Aging (Article)
Subject: Failure Mechanism , Tab Bonded , Thermal , Aging
Author: Elke Zakel      Herbert Reichl     
page:      856 - 864
A New Power Cycling Technique For Accelerated Reliability Evaluation Of Plated Through Holes And Interconnects In Pcb'S (Article)
Subject: Reliability Evaluation , Interconnects , Pcb , Pth Powering
Author: Ramachandra Munikoti      Pulak Dhar     
page:      865 - 872
Mechanism Of Electromigration In Ceramic Packages Induced By Chip-Coating Polyimide (Article)
Subject: Mechanism , Electromigration , Ceramic Packages , Polyimide
Author: Youji Mashiko      Masanobu Kohara     
page:      873 - 878
Relation Between Delamination And Temperature Cycling Induced Failures In Plastic Packaged Devices (Article)
Subject: Delamination , Temperature Cycling , Failure , Plastic-Packaged
Author: Karel Van Doorselaer      Kees De Zeeuw     
page:      879 - 882
Silicone Die Bond Adhesive And Clean In-Line Cure For Copper Lead Frame (Article)
Subject: Die Bond , Adhesive , Cure , Copper
Author: Kazunari Suzuki      Tomoko Higashino     
page:      883 - 887
In Situ Calibration Of Stress Chips (Article)
Subject: In Situ , Calibration , Stress , Chip Design
Author: Adel F. Bastawros      Arkady S. Voloshin     
page:      888 - 892
Mechanical Engineering Issues And Electronic Equipment Reliability: Incurred Costs Without Compensating Benefits (Article)
Subject: Mechanical Engineering , Electronic Equipment Reliability , Compensation System , Benefit Cost
Author: Charles T. Leonard     
page:      895 - 902
The Use Environments Of Electronic Assemblies And Their Impact On Surface Mount Solder Attachment Reliability (Article)
Subject: Surface Mount Technology , Attachment , Reliability , Solder Reliability
Author: Werner Engelmaier     
page:      903 - 908
Effect Of Temperature On Isothermal Fatigue Of Solders (Article)
Subject: Effect Of Temperature , Isothermal Model , Fatigue , Soldering
Author: S. Vaynman     
page:      909 - 913
Creep Strains In An Elongated Bond Layer (Article)
Subject: Creep , Strains , Elongation , Bond
Author: Sheera Knecht     
page:      914 - 928
Shear Deformation Of Indium Solder Joints (Article)
Subject: Shear Deformation , Indium , Solder Joint Reliability
Author: Robert Darveaux      Lwona Turlik     
page:      929 - 939
Thermally Induced Ic Package Cracking (Article)
Subject: Thermally Induced Separation , Ic Packages , Cracking , Pin
Author: David Suhl     
page:      940 - 945
Silicon Interconnect-A Critical Factor In Device Thermal Management (Article)
Subject: Silicon Interconnect , Critical Factor , Device Thermal Management , Device Packaging
Author: Kevin Smith      Sorin Witzman      George Metelski     
page:      946 - 952
Monte Carlo Thermal Optimization Of Populated Printed Circuit Board (Article)
Subject: Monte Carlo , Thermal Optimization , Printed Circuit Board
Author: T Elperin      Avram Bar-Cohen      Rami Eliasi     
page:      953 - 960
Transient Thermal Strain Measurements In Electronic Packages (Article)
Subject: Transient Thermal Modelling , Strain Measurements , Electronic Packaging
Author: Adel F. Bastawros      Arkady S. Voloshin     
page:      961 - 966
Effect Of Cooling Mechanism And Powering Configurations On Thermal Impedances In An Electronic Enclosure (Article)
Subject: Effect Of Cooling , Mechanism , Configuration , Impedance
Author: Vincent P. Manno      K Azar      Gary Leisk     
page:      967 - 974
Thermal Characteristics Of Single And Multilayer High Performance Pqfp Packages (Article)
Subject: Thermal Characteristics , High Performance , Multilayer
Author: Debendra Mallik      Mostafa Aghazadeh     
page:      975 - 979
Transient Thermal Study Of Semiconductor Devices\ (Article)
Subject: Transient Thermal Modelling , Semiconductor Devices , Software Development , Three-Dimensional Transient Inversion
Author: Chin C. Lee      Arthur L. Palisoc      Y. Jay Min     
page:      980 - 988
Thermal Characteristics Of Tab For Small Systems (Article)
Subject: Thermal Characteristics , Tab , Tab For Small Systems , Orientation
Author: Lawrence Buller      Barbara Mcnelis     
page:      989 - 997
Substrate Impact On The Thermal Performance Of Tape Automated Bonding Components (Article)
Subject: Substrate , Impact , Thermal Performance , Tape Automated Bonding Components
Author: Tracy L. Davis     
page:      998 - 1005